The device is used to cut through contours and holes in the ceramic materials of 22ХС type, aluminum nitride, polycrystalline corund and other types of alumina ceramics and materials like Green Tape, LTCC using quasi solid-state laser with a wavelength of 1, 06 mic. The device provides the possibility of obtaining laser marking (engraving) on the surface of the workpiece.

Processing is carried out by the plate relative to the stationary laser beam movement. The device is used to produce microelectronic devices and in other spheres.

Specifications:

Plate thickness – up to 3 mm

Processing area – 150x150 mm

Coordinate table XY movement inaccuracy – 0.010 mm

The minimum increment XY - 0,001 mm

The diameter(d) minimum of cut holes depends on the thickness of the plate(S) and must satisfy the relation d=0,1S, but not less than 50 mic for raw Green Tape and at least 100 mic for ceramics and polycrystalline corund.

The reproducibility of the coordinate table XY movement - not more than 5 mic.